DisCoTec 06

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DAIS 06

6th IFIP WG 6.1
International Conference on
Distributed Applications and Interoperable Systems

General chair:
Gianluigi Zavattaro, University of Bologna, Italy

Steering committee:
Lea Kutvonen, University of Helsinki, Finland
Hartmut Koenig, BTU Cottbus, Germany
Kurt Geihs, University of Kassel, Germany
Elie Najm, ENST, Paris, France

PC Chairs:
Frank Eliassen, University of Oslo, Norway
Alberto Montresor, University of Trento, Italy

Publicity chair:
Ketil Lund, Simula Research Laboratory, Norway

Program committee:
N. Alonistioti, University of Athens, Greece
D. Bakken, Washington State University, USA
A. Bartoli, University of Trieste, Italy
Y. Berbers, Katholieke Universiteit Leuven, Belgium
A. Beugnard, ENST-Bretagne, France
G. Blair, Lancaster University, UK
A. Corsaro, Alenia Marconi System, Italy
I. Demeure, ENST, France
F. Eliassen, University of Oslo, Norway
P. Felber, Université de Neuchâtel, Switzerland,
K. Geihs, University of Kassel, Germany
K. M. Goschka, Technical University of Vienna, Austria
S. Graupner, HP Labs, USA
R. Grønmo, SINTEF ICT, Norway
D. Hagimont, INP Toulouse, France
S. Hallsteinsen, SINTEF ICT, Norway
S. Haridi, SICS, Sweden
J. Indulska, University of Queensland, Australia
E. Jul, Microsoft Research, Cambridge, UK
A. Keller, IBM Thomas J. Watson Research Center, USA
H. Koenig, BTU Cottbus, Germany
R. Kroeger, Univeristy of Applied Sciences Wiesbaden, Germany
H. Krumm, University of Dortmund, Germany
L. Kutvonen, University of Helsinki, Finland
W. Lamersdorf, University of Hamburg, Germany
C. Linnhof-Popien, University of Munich, Germany
K. Lund, Simula Research Laboratory, Norway
R. Meier, Trinity College Dublin, Ireland
A. Montresor, University of Trento, Italy
E. Najm, ENST, France
R. Oliveira, Universidade do Minho, Portugal
K. Raymond, University of Queensland, Australia
R. Schantz, BBN Technologies, USA
A. Romanovsky, University of Newcastle upon Tyne, UK
W. Schreiner, Johannes Kepler University Linz, Austria
T. Senivongse, Chulalongkorn University, Thailand
K. Sere, Åbo Akademi University, Finland
J.-B. Stefani, INRIA, France
N. Wang, Tech-X Corporation, USA