About the conference:

In recent years, distributed applications have indeed gained a practical and widely-known footing in everyday computing. Use of new communication technologies have brought up divergent application areas, including mobile computing, inter-enterprise collaborations, and ubiquitous services, just to name a few. New challenges include the need for service-oriented architectures, autonomous and self-managing systems, peer-to-peer systems, grid computing, sensor networks, semantic enhancements, and adaptivity and dynamicity of distribution constellations.

The DAIS conference series addresses all aspects of distributed applications, including their design, implementation and operation, the supporting middleware, appropriate software engineering methodologies and tools, as well as experimental studies and practice reports. This time we welcome in particular contributions on architectures, models, technologies and platforms for interoperable, scalable and adaptable systems that are related to the latest trends towards service orientation and self-* properties.

DAIS'06 is the sixth event in a series of successful international conferences which started in 1997. It will provide a forum for researchers, application and platform service vendors and users, to review, discuss and learn about new approaches, trends, concepts and experiences in the fields of distributed computing. Due to the success of the predecessor conferences and the emergence of many interesting and relevant new topics, DAIS has recently switched to a one-year-rhythm.

Conference themes:

DAIS'06 solicits high quality papers reporting research results and/or experience reports. All papers must be original, unpublished, and not submitted simultaneously for publication elsewhere.

DAIS'06 especially encourages submissions addressing the following topics:

Submission guidelines:

Submissions must be done electronically as postscript or PDF, using the Springer LNCS style. DAIS'06 seeks:
- Full technical papers in no more than 14 pages,
- Work-in-progress papers, describing on-going work and interim results,
in no more than 6 pages. Work-in-progress papers should be submitted by email to dais06@cs.unibo.it.

Both categories of papers will be reviewed thoroughly by the DAIS'06 Program Committee. Accepted papers will appear in the conference proceedings published by Springer Verlag in the LNCS series.

Important dates:

Abstract submission January 15, 2006
Full paper submission: January 22, 2006
Work-in-progress papers: January 31, 2006
Notification of acceptance: March 7, 2006
Camera ready version: March 28, 2006
Conference dates: June 14-16, 2006

Venue & Event:

DAIS'06 will be held in the beautiful city of Bologna, Italy, colocated with the 8th IFIP Formal Methods for Open Object-Based Distributed Systems (FMOODS'06) and Coordination'06. Attendants of DAIS'06 will have the opportunity to attend the sessions of the two colocated conferences.

Bologna, a historical capital of culture, was founded by the Etruscans in the VI century B.C. Bologna sits in the southern part of the historically and gastronomically famous Po River plain, a natural crossroads in northern Italy. Bologna's location was important not only for the trading of goods but also for the exchanging of ideas and the disseminating of culture. The Università di Bologna, founded in 1088 is
the oldest university in the western world.

Bologna is famous for its porticoes. Dating back to the 12th century the porticoes were used to enlarge houses to support the growing University community. Today 350,000 people call Bologna their home, of which 100,000 are students. Bologna, Italy's culinary capital, is also famous for its food. Furthermore, Bologna is surrounded by the famous food/wine regions of Parma, Modena, and Tuscany.

Bologna is very accessible, being served by an international airport and one of the main hubs of the Italian railway system. Within easy access is Florence (1 hour), Milan (1.5 hours), Venice (1.5 hours), Rome (2.4 hours) and the ubiquitous Italian countryside of Emilia-Romagna and Tuscany.

Organisers:

General chair:
Gianluigi Zavattaro, University of Bologna, Italy

Steering committee:
Lea Kutvonen, University of Helsinki, Finland
Hartmut Koenig, BTU Cottbus, Germany
Kurt Geihs, University of Kassel, Germany
Elie Najm, ENST, Paris, France

PC Chairs:
Frank Eliassen, University of Oslo, Norway
Alberto Montresor, University of Trento, Italy

Publicity chair:
Ketil Lund, Simula Research Laboratory, Norway

Program committee:
N. Alonistioti, University of Athens, Greece
D. Bakken, Washington State University, USA
A. Bartoli, University of Trieste, Italy
Y. Berbers, Katholieke Universiteit Leuven, Belgium
A. Beugnard, ENST-Bretagne, France
G. Blair, Lancaster University, UK
A. Corsaro, Alenia Marconi System, Italy
I. Demeure, ENST, France
F. Eliassen, University of Oslo, Norway
P. Felber, Université de Neuchâtel, Switzerland,
K. Geihs, University of Kassel, Germany
K. M. Goschka, Technical University of Vienna, Austria
S. Graupner, HP Labs, USA
R. Grønmo, SINTEF ICT, Norway
D. Hagimont, INP Toulouse, France
S. Hallsteinsen, SINTEF ICT, Norway
S. Haridi, SICS, Sweden
J. Indulska, University of Queensland, Australia
E. Jul, Microsoft Research, Cambridge, UK
A. Keller, IBM Thomas J. Watson Research Center, USA
H. Koenig, BTU Cottbus, Germany
R. Kroeger, Univeristy of Applied Sciences Wiesbaden, Germany
H. Krumm, University of Dortmund, Germany
L. Kutvonen, University of Helsinki, Finland
W. Lamersdorf, University of Hamburg, Germany
C. Linnhof-Popien, University of Munich, Germany
K. Lund, Simula Research Laboratory, Norway
R. Meier, Trinity College Dublin, Ireland
A. Montresor, University of Trento, Italy
E. Najm, ENST, France
R. Oliveira, Universidade do Minho, Portugal
K. Raymond, University of Queensland, Australia
R. Schantz, BBN Technologies, USA
A. Romanovsky, University of Newcastle upon Tyne, UK
W. Schreiner, Johannes Kepler University Linz, Austria
T. Senivongse, Chulalongkorn University, Thailand
K. Sere, Åbo Akademi University, Finland
J.-B. Stefani, INRIA, France
N. Wang, Tech-X Corporation, USA